7.9 1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64μ m Unit Pixels Separated by Full-Depth Deep-Trench Isolation

JongEun Park, Sungbong Park, Kwansik Cho, Taehun Lee, ChangKyu Lee, Donghyun Kim, Beomsuk Lee, SungIn Kim, Ho-Chul Ji, Dongmo Im, Haeyong Park, Jinyoung Kim, Jungho Cha, Tae Hoon Kim, Insung Joe, Soojin Hong, Chongkwang Chang, Jingyun Kim, WooGwan Shim, Taehee Kim, Jamie Lee, Donghyuk Park, Euiyeol Kim, Howoo Park, Jaekyu Lee, Yitae Kim, JungChak Ahn, Youngki Hong, ChungSam Jun, Hyunchul Kim, Chang-Rok Moon, Ho-Kyu Kang. 7.9 1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64μ m Unit Pixels Separated by Full-Depth Deep-Trench Isolation. In IEEE International Solid-State Circuits Conference, ISSCC 2021, San Francisco, CA, USA, February 13-22, 2021. pages 122-124, IEEE, 2021. [doi]

@inproceedings{ParkPCLLKLKJIPK21,
  title = {7.9 1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64μ m Unit Pixels Separated by Full-Depth Deep-Trench Isolation},
  author = {JongEun Park and Sungbong Park and Kwansik Cho and Taehun Lee and ChangKyu Lee and Donghyun Kim and Beomsuk Lee and SungIn Kim and Ho-Chul Ji and Dongmo Im and Haeyong Park and Jinyoung Kim and Jungho Cha and Tae Hoon Kim and Insung Joe and Soojin Hong and Chongkwang Chang and Jingyun Kim and WooGwan Shim and Taehee Kim and Jamie Lee and Donghyuk Park and Euiyeol Kim and Howoo Park and Jaekyu Lee and Yitae Kim and JungChak Ahn and Youngki Hong and ChungSam Jun and Hyunchul Kim and Chang-Rok Moon and Ho-Kyu Kang},
  year = {2021},
  doi = {10.1109/ISSCC42613.2021.9365751},
  url = {https://doi.org/10.1109/ISSCC42613.2021.9365751},
  researchr = {https://researchr.org/publication/ParkPCLLKLKJIPK21},
  cites = {0},
  citedby = {0},
  pages = {122-124},
  booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2021, San Francisco, CA, USA, February 13-22, 2021},
  publisher = {IEEE},
  isbn = {978-1-7281-9549-0},
}