Sunghyun Park, Alice Wang, Uming Ko, Li-Shiuan Peh, Anantha P. Chandrakasan. Enabling simultaneously bi-directional TSV signaling for energy and area efficient 3D-ICs. In Luca Fanucci, Jürgen Teich, editors, 2016 Design, Automation & Test in Europe Conference & Exhibition, DATE 2016, Dresden, Germany, March 14-18, 2016. pages 163-168, IEEE, 2016. [doi]
@inproceedings{ParkWKPC16,
title = {Enabling simultaneously bi-directional TSV signaling for energy and area efficient 3D-ICs},
author = {Sunghyun Park and Alice Wang and Uming Ko and Li-Shiuan Peh and Anantha P. Chandrakasan},
year = {2016},
url = {http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=7459298},
researchr = {https://researchr.org/publication/ParkWKPC16},
cites = {0},
citedby = {0},
pages = {163-168},
booktitle = {2016 Design, Automation & Test in Europe Conference & Exhibition, DATE 2016, Dresden, Germany, March 14-18, 2016},
editor = {Luca Fanucci and Jürgen Teich},
publisher = {IEEE},
isbn = {978-3-9815-3707-9},
}