Enabling simultaneously bi-directional TSV signaling for energy and area efficient 3D-ICs

Sunghyun Park, Alice Wang, Uming Ko, Li-Shiuan Peh, Anantha P. Chandrakasan. Enabling simultaneously bi-directional TSV signaling for energy and area efficient 3D-ICs. In Luca Fanucci, J├╝rgen Teich, editors, 2016 Design, Automation & Test in Europe Conference & Exhibition, DATE 2016, Dresden, Germany, March 14-18, 2016. pages 163-168, IEEE, 2016. [doi]

Abstract

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