Accurate Power and Latency Analysis of a Through-Silicon Via(TSV)

Ujjwal Pasupulety, Bheemappa Halavar, Basavaraj Talawar. Accurate Power and Latency Analysis of a Through-Silicon Via(TSV). In 2018 International Conference on Advances in Computing, Communications and Informatics, ICACCI 2018, Bangalore, India, September 19-22, 2018. pages 688-694, IEEE, 2018. [doi]

Abstract

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