Thermal Aware Design for Through-Silicon Via (TSV) based 3D Network-on-Chip (NoC) Architectures - researchr publication authors

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Ujjwal Pasupulety, Bheemappa Halavar, Basavaraj Talawar. Thermal Aware Design for Through-Silicon Via (TSV) based 3D Network-on-Chip (NoC) Architectures. In Bijoy Antony Jose, Jimson Mathew, editors, 8th International Symposium on Embedded Computing and System Design, ISED 2018, Cochin, India, December 13-15, 2018. pages 236-240, IEEE, 2018. [doi]

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