Thermal-aware Steiner routing for 3D stacked ICs

Mohit Pathak, Sung Kyu Lim. Thermal-aware Steiner routing for 3D stacked ICs. In Georges G. E. Gielen, editor, 2007 International Conference on Computer-Aided Design (ICCAD 07), November 5-8, 2007, San Jose, CA, USA. pages 205-211, IEEE, 2007. [doi]

Authors

Mohit Pathak

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Sung Kyu Lim

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