Thermal-aware Steiner routing for 3D stacked ICs

Mohit Pathak, Sung Kyu Lim. Thermal-aware Steiner routing for 3D stacked ICs. In Georges G. E. Gielen, editor, 2007 International Conference on Computer-Aided Design (ICCAD 07), November 5-8, 2007, San Jose, CA, USA. pages 205-211, IEEE, 2007. [doi]

Abstract

Abstract is missing.