Through-silicon-via management during 3D physical design: When to add and how many? - researchr publication authors

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Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Kyu Lim. Through-silicon-via management during 3D physical design: When to add and how many?. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 387-394, IEEE, 2010. [doi]

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