Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Kyu Lim. Through-silicon-via management during 3D physical design: When to add and how many?. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 387-394, IEEE, 2010. [doi]
@inproceedings{PathakLML10,
title = {Through-silicon-via management during 3D physical design: When to add and how many?},
author = {Mohit Pathak and Young-Joon Lee and Thomas Moon and Sung Kyu Lim},
year = {2010},
doi = {10.1109/ICCAD.2010.5653703},
url = {http://dx.doi.org/10.1109/ICCAD.2010.5653703},
tags = {design},
researchr = {https://researchr.org/publication/PathakLML10},
cites = {0},
citedby = {0},
pages = {387-394},
booktitle = {2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA},
publisher = {IEEE},
}