Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs - researchr publication authors

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Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim. Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. In 2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, California, USA, November 7-10, 2011. pages 555-562, IEEE, 2011. [doi]

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