Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim. Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. In 2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, California, USA, November 7-10, 2011. pages 555-562, IEEE, 2011. [doi]
@inproceedings{PathakPPL11,
title = {Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs},
author = {Mohit Pathak and Jiwoo Pak and David Z. Pan and Sung Kyu Lim},
year = {2011},
doi = {10.1109/ICCAD.2011.6105385},
url = {http://dx.doi.org/10.1109/ICCAD.2011.6105385},
researchr = {https://researchr.org/publication/PathakPPL11},
cites = {0},
citedby = {0},
pages = {555-562},
booktitle = {2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, California, USA, November 7-10, 2011},
publisher = {IEEE},
isbn = {978-1-4577-1399-6},
}