Reliability degradation with electrical, thermal and thermal gradient stress in interconnects - researchr publication authors

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Srijita Patra, Degang Chen, Randy Geiger. Reliability degradation with electrical, thermal and thermal gradient stress in interconnects. In 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), Beijing, China, May 19-23, 2013. pages 1063-1066, IEEE, 2013. [doi]

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