Srijita Patra, Degang Chen, Randy Geiger. Reliability degradation with electrical, thermal and thermal gradient stress in interconnects. In 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), Beijing, China, May 19-23, 2013. pages 1063-1066, IEEE, 2013. [doi]
@inproceedings{PatraCG13,
title = {Reliability degradation with electrical, thermal and thermal gradient stress in interconnects},
author = {Srijita Patra and Degang Chen and Randy Geiger},
year = {2013},
doi = {10.1109/ISCAS.2013.6572033},
url = {http://dx.doi.org/10.1109/ISCAS.2013.6572033},
researchr = {https://researchr.org/publication/PatraCG13},
cites = {0},
citedby = {0},
pages = {1063-1066},
booktitle = {2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), Beijing, China, May 19-23, 2013},
publisher = {IEEE},
isbn = {978-1-4673-5760-9},
}