Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Lan Peng, HongYu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan. Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]

This author has not been identified. Look up 'Lan Peng' in GoogleThis author has not been identified. Look up 'HongYu Li' in GoogleThis author has not been identified. Look up 'Dau Fatt Lim' in GoogleThis author has not been identified. Look up 'Riko I. Made' in GoogleThis author has not been identified. Look up 'Guo-Qiang Lo' in GoogleThis author has not been identified. Look up 'Dim-Lee Kwong' in GoogleThis author has not been identified. Look up 'Chuan Seng Tan' in Google

runs on WebDSL