Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement

Lan Peng, HongYu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan. Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]

Abstract

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