Baoli Peng, Vasilis F. Pavlidis, Yi-Chung Chen, Yuanqing Cheng. Thermal Modeling and Design Exploration for Monolithic 3D ICs. In 23rd International Symposium on Quality Electronic Design, ISQED 2022, Santa Clara, CA, USA, April 6-7, 2022. pages 1-6, IEEE, 2022. [doi]
Abstract is missing.