Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling

Yarui Peng, Dusan Petranovic, Sung Kyu Lim. Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling. IEEE Trans. on CAD of Integrated Circuits and Systems, 34(12):1964-1976, 2015. [doi]

Abstract

Abstract is missing.