Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs

Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim. Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs. In Diana Marculescu, Frank Liu, editors, Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015, Austin, TX, USA, November 2-6, 2015. pages 649-655, ACM, 2015. [doi]

Abstract

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