Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing

Shaoyi Peng, Han Zhou, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan. Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing. IEEE Trans. VLSI Syst., 26(2):239-248, 2018. [doi]

@article{PengZKCT18,
  title = {Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing},
  author = {Shaoyi Peng and Han Zhou and Taeyoung Kim and Hai-Bao Chen and Sheldon X.-D. Tan},
  year = {2018},
  doi = {10.1109/TVLSI.2017.2764880},
  url = {http://doi.ieeecomputersociety.org/10.1109/TVLSI.2017.2764880},
  researchr = {https://researchr.org/publication/PengZKCT18},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. VLSI Syst.},
  volume = {26},
  number = {2},
  pages = {239-248},
}