Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs

Sai Pentapati, Sung Kyu Lim. Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs. IEEE Trans. VLSI Syst., 32(3):413-421, March 2024. [doi]

@article{PentapatiL24,
  title = {Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs},
  author = {Sai Pentapati and Sung Kyu Lim},
  year = {2024},
  month = {March},
  doi = {10.1109/TVLSI.2023.3347372},
  url = {https://doi.org/10.1109/TVLSI.2023.3347372},
  researchr = {https://researchr.org/publication/PentapatiL24},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. VLSI Syst.},
  volume = {32},
  number = {3},
  pages = {413-421},
}