Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs

Sai Pentapati, Sung Kyu Lim. Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs. IEEE Trans. VLSI Syst., 32(3):413-421, March 2024. [doi]

Abstract

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