Paul Pfäffli, H. Y. Wong, X. Xu, L. Silvestri, X. W. Lin, T. Yang, Ravi Tiwari, S. Mahapatra, S. Motzny, V. Moroz, T. Ma. TCAD modeling for reliability. Microelectronics Reliability, 88:1083-1089, 2018. [doi]
@article{PfaffliWXSLYTMM18,
title = {TCAD modeling for reliability},
author = {Paul Pfäffli and H. Y. Wong and X. Xu and L. Silvestri and X. W. Lin and T. Yang and Ravi Tiwari and S. Mahapatra and S. Motzny and V. Moroz and T. Ma},
year = {2018},
doi = {10.1016/j.microrel.2018.06.109},
url = {https://doi.org/10.1016/j.microrel.2018.06.109},
researchr = {https://researchr.org/publication/PfaffliWXSLYTMM18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {88},
pages = {1083-1089},
}