3D ICs: An opportunity for fully-integrated, dense and efficient power supplies

Gaël Pillonnet, Nicolas Jeanniot, Pascal Vivet. 3D ICs: An opportunity for fully-integrated, dense and efficient power supplies. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]

Authors

Gaël Pillonnet

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Nicolas Jeanniot

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Pascal Vivet

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