Gaël Pillonnet, Nicolas Jeanniot, Pascal Vivet. 3D ICs: An opportunity for fully-integrated, dense and efficient power supplies. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
@inproceedings{PillonnetJV15,
title = {3D ICs: An opportunity for fully-integrated, dense and efficient power supplies},
author = {Gaël Pillonnet and Nicolas Jeanniot and Pascal Vivet},
year = {2015},
doi = {10.1109/3DIC.2015.7334574},
url = {http://dx.doi.org/10.1109/3DIC.2015.7334574},
researchr = {https://researchr.org/publication/PillonnetJV15},
cites = {0},
citedby = {0},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9385-0},
}