M:::3:::-Modular Multi-Scale Assembly System for MEMS Packaging - researchr publication authors

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Dan O. Popa, Rakesh Murthy, Manoj Mitta, Jeongsik Sin, Harry E. Stephanou. M:::3:::-Modular Multi-Scale Assembly System for MEMS Packaging. In 2006 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2006, October 9-15, 2006, Beijing, China. pages 3712-3717, IEEE, 2006. [doi]

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