Dan O. Popa, Rakesh Murthy, Manoj Mitta, Jeongsik Sin, Harry E. Stephanou. M:::3:::-Modular Multi-Scale Assembly System for MEMS Packaging. In 2006 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2006, October 9-15, 2006, Beijing, China. pages 3712-3717, IEEE, 2006. [doi]
@inproceedings{PopaMMSS06,
title = {M:::3:::-Modular Multi-Scale Assembly System for MEMS Packaging},
author = {Dan O. Popa and Rakesh Murthy and Manoj Mitta and Jeongsik Sin and Harry E. Stephanou},
year = {2006},
doi = {10.1109/IROS.2006.281751},
url = {http://dx.doi.org/10.1109/IROS.2006.281751},
tags = {e-science},
researchr = {https://researchr.org/publication/PopaMMSS06},
cites = {0},
citedby = {0},
pages = {3712-3717},
booktitle = {2006 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2006, October 9-15, 2006, Beijing, China},
publisher = {IEEE},
}