Manjari Pradhan, Chandan Giri, Hafizur Rahaman, Debesh K. Das. Optimal stacking of SOCs in a 3D-SIC for post-bond testing. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-5, IEEE, 2013. [doi]
Abstract is missing.