Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Patrick Preuss, André Naumann, Wolfgang Scholl, Boon-Ping Gan, Peter Lendermann. Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling. In Stephen J. Buckley, John A. Miller, editors, Proceedings of the 2014 Winter Simulation Conference, Savannah, GA, USA, December 7-10, 2014. pages 2444-2453, IEEE/ACM, 2014. [doi]

This author has not been identified. Look up 'Patrick Preuss' in GoogleThis author has not been identified. Look up 'André Naumann' in GoogleThis author has not been identified. Look up 'Wolfgang Scholl' in GoogleThis author has not been identified. Look up 'Boon-Ping Gan' in GoogleThis author has not been identified. Look up 'Peter Lendermann' in Google

runs on WebDSL