Patrick Preuss, André Naumann, Wolfgang Scholl, Boon-Ping Gan, Peter Lendermann. Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling. In Stephen J. Buckley, John A. Miller, editors, Proceedings of the 2014 Winter Simulation Conference, Savannah, GA, USA, December 7-10, 2014. pages 2444-2453, IEEE/ACM, 2014. [doi]
@inproceedings{PreussNSGL14,
title = {Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling},
author = {Patrick Preuss and André Naumann and Wolfgang Scholl and Boon-Ping Gan and Peter Lendermann},
year = {2014},
url = {http://dl.acm.org/citation.cfm?id=2694156},
researchr = {https://researchr.org/publication/PreussNSGL14},
cites = {0},
citedby = {0},
pages = {2444-2453},
booktitle = {Proceedings of the 2014 Winter Simulation Conference, Savannah, GA, USA, December 7-10, 2014},
editor = {Stephen J. Buckley and John A. Miller},
publisher = {IEEE/ACM},
}