Patrick Preuss, André Naumann, Wolfgang Scholl, Boon-Ping Gan, Peter Lendermann. Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling. In Stephen J. Buckley, John A. Miller, editors, Proceedings of the 2014 Winter Simulation Conference, Savannah, GA, USA, December 7-10, 2014. pages 2444-2453, IEEE/ACM, 2014. [doi]
Abstract is missing.