Rene Puschmann, Mathias Bottcher, Irene Bartusseck, Frank Windrich, Conny Fiedler, Peggy John, Charles Alix Manier, Kai Zoschke, Jurgen Grafe, Hermann Oppermann, Jürgen Wolf, K. Dieter Lang, Michael Ziesmann. 3D integration of standard integrated circuits. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-7, IEEE, 2013. [doi]
Abstract is missing.