Kiran Puttaswamy, Gabriel H. Loh. Thermal analysis of a 3D die-stacked high-performance microprocessor. In Gang Qu, Yehea I. Ismail, Narayanan Vijaykrishnan, Hai Zhou, editors, Proceedings of the 16th ACM Great Lakes Symposium on VLSI 2006, Philadelphia, PA, USA, April 30 - May 1, 2006. pages 19-24, ACM, 2006. [doi]
Abstract is missing.