Three-dimensional simulation of HPCVD-linking continuum transport and reaction kinetics with topography simulation - researchr publication authors

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Wolfgang Pyka, Peter Fleischmann, Bernhard Haindl, Siegfried Selberherr. Three-dimensional simulation of HPCVD-linking continuum transport and reaction kinetics with topography simulation. IEEE Trans. on CAD of Integrated Circuits and Systems, 18(12):1741-1749, 1999. [doi]

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