Wolfgang Pyka, Peter Fleischmann, Bernhard Haindl, Siegfried Selberherr. Three-dimensional simulation of HPCVD-linking continuum transport and reaction kinetics with topography simulation. IEEE Trans. on CAD of Integrated Circuits and Systems, 18(12):1741-1749, 1999. [doi]
@article{PykaFHS99,
title = {Three-dimensional simulation of HPCVD-linking continuum transport and reaction kinetics with topography simulation},
author = {Wolfgang Pyka and Peter Fleischmann and Bernhard Haindl and Siegfried Selberherr},
year = {1999},
doi = {10.1109/43.811323},
url = {http://doi.ieeecomputersociety.org/10.1109/43.811323},
researchr = {https://researchr.org/publication/PykaFHS99},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {18},
number = {12},
pages = {1741-1749},
}