Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects - researchr publication authors

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Hanhua Qian, Hao Liang, Chip-Hong Chang, Wei Zhang, Hao Yu. Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects. In 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013. pages 485-490, IEEE, 2013. [doi]

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