Hanhua Qian, Hao Liang, Chip-Hong Chang, Wei Zhang, Hao Yu. Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects. In 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013. pages 485-490, IEEE, 2013. [doi]
@inproceedings{QianLCZY13,
title = {Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects},
author = {Hanhua Qian and Hao Liang and Chip-Hong Chang and Wei Zhang and Hao Yu},
year = {2013},
doi = {10.1109/ASPDAC.2013.6509643},
url = {http://dx.doi.org/10.1109/ASPDAC.2013.6509643},
researchr = {https://researchr.org/publication/QianLCZY13},
cites = {0},
citedby = {0},
pages = {485-490},
booktitle = {18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013},
publisher = {IEEE},
isbn = {978-1-4673-3029-9},
}