Jiajie Qiu, Hongjin Kim, Fangzhou Xia 0001, Kamal Youcef-Toumi. Multi-axis Active Vibration Suppression for Wafer Transfer Systems. In IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2023, Seattle, WA, USA, June 28-30, 2023. pages 1108-1114, IEEE, 2023. [doi]
@inproceedings{QiuKXY23,
title = {Multi-axis Active Vibration Suppression for Wafer Transfer Systems},
author = {Jiajie Qiu and Hongjin Kim and Fangzhou Xia 0001 and Kamal Youcef-Toumi},
year = {2023},
doi = {10.1109/AIM46323.2023.10196218},
url = {https://doi.org/10.1109/AIM46323.2023.10196218},
researchr = {https://researchr.org/publication/QiuKXY23},
cites = {0},
citedby = {0},
pages = {1108-1114},
booktitle = {IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2023, Seattle, WA, USA, June 28-30, 2023},
publisher = {IEEE},
isbn = {978-1-6654-7633-1},
}