Multi-axis Active Vibration Suppression for Wafer Transfer Systems

Jiajie Qiu, Hongjin Kim, Fangzhou Xia 0001, Kamal Youcef-Toumi. Multi-axis Active Vibration Suppression for Wafer Transfer Systems. In IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2023, Seattle, WA, USA, June 28-30, 2023. pages 1108-1114, IEEE, 2023. [doi]

Abstract

Abstract is missing.