Xiang Qiu, Malgorzata Marek-Sadowska, Wojciech P. Maly. Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips. IEEE Trans. VLSI Syst., 23(5):869-878, 2015. [doi]
@article{QiuMM15,
title = {Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips},
author = {Xiang Qiu and Malgorzata Marek-Sadowska and Wojciech P. Maly},
year = {2015},
doi = {10.1109/TVLSI.2014.2325551},
url = {http://dx.doi.org/10.1109/TVLSI.2014.2325551},
researchr = {https://researchr.org/publication/QiuMM15},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {23},
number = {5},
pages = {869-878},
}