Xiang Qiu, Malgorzata Marek-Sadowska, Wojciech P. Maly. Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips. IEEE Trans. VLSI Syst., 23(5):869-878, 2015. [doi]
No references recorded for this publication.
No citations of this publication recorded.