Design of Embedded Vacuum Packaging System Based on Single-Chip Microcomputer Touch Screen - researchr publication authors

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Mingfei Qu, Dan Zhao, Nan Chen. Design of Embedded Vacuum Packaging System Based on Single-Chip Microcomputer Touch Screen. In 6th International Conference on Dependable Systems and Their Applications, DSA 2019, Harbin, China, January 3-6, 2020. pages 523-525, IEEE, 2019. [doi]

This author has not been identified. Look up 'Mingfei Qu' in GoogleThis author has not been identified. Look up 'Dan Zhao' in GoogleThis author has not been identified. Look up 'Nan Chen' in Google

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