Mingfei Qu, Dan Zhao, Nan Chen. Design of Embedded Vacuum Packaging System Based on Single-Chip Microcomputer Touch Screen. In 6th International Conference on Dependable Systems and Their Applications, DSA 2019, Harbin, China, January 3-6, 2020. pages 523-525, IEEE, 2019. [doi]
@inproceedings{QuZC19-1,
title = {Design of Embedded Vacuum Packaging System Based on Single-Chip Microcomputer Touch Screen},
author = {Mingfei Qu and Dan Zhao and Nan Chen},
year = {2019},
doi = {10.1109/DSA.2019.00096},
url = {https://doi.org/10.1109/DSA.2019.00096},
researchr = {https://researchr.org/publication/QuZC19-1},
cites = {0},
citedby = {0},
pages = {523-525},
booktitle = {6th International Conference on Dependable Systems and Their Applications, DSA 2019, Harbin, China, January 3-6, 2020},
publisher = {IEEE},
isbn = {978-1-7281-6057-3},
}