Design of Embedded Vacuum Packaging System Based on Single-Chip Microcomputer Touch Screen

Mingfei Qu, Dan Zhao, Nan Chen. Design of Embedded Vacuum Packaging System Based on Single-Chip Microcomputer Touch Screen. In 6th International Conference on Dependable Systems and Their Applications, DSA 2019, Harbin, China, January 3-6, 2020. pages 523-525, IEEE, 2019. [doi]

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