Tarek Ramadan, Eslam Yahya, Mohamed Dessouky, Yehea Ismail. Accuracy-improved coupling capacitance model for through-silicon via (TSV) arrays using dimensional analysis. In IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montréal, QC, Canada, May 22-25, 2016. pages 1930-1933, IEEE, 2016. [doi]
@inproceedings{RamadanYDI16,
title = {Accuracy-improved coupling capacitance model for through-silicon via (TSV) arrays using dimensional analysis},
author = {Tarek Ramadan and Eslam Yahya and Mohamed Dessouky and Yehea Ismail},
year = {2016},
doi = {10.1109/ISCAS.2016.7538951},
url = {http://dx.doi.org/10.1109/ISCAS.2016.7538951},
researchr = {https://researchr.org/publication/RamadanYDI16},
cites = {0},
citedby = {0},
pages = {1930-1933},
booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montréal, QC, Canada, May 22-25, 2016},
publisher = {IEEE},
isbn = {978-1-4799-5341-7},
}