Tarek Ramadan, Eslam Yahya, Mohamed Dessouky, Yehea Ismail. Accuracy-improved coupling capacitance model for through-silicon via (TSV) arrays using dimensional analysis. In IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montréal, QC, Canada, May 22-25, 2016. pages 1930-1933, IEEE, 2016. [doi]
Abstract is missing.