Measuring Non-Redundant VIA Test-Coverage for Automotive Designs in Lower Process Nodes

Saidapet Ramesh, Rahul Kalyan, Jesse Yanez, Andreas Glowatz, Maija Ryynänen, Sergej Schwarz. Measuring Non-Redundant VIA Test-Coverage for Automotive Designs in Lower Process Nodes. In IEEE International Test Conference, ITC 2023, Anaheim, CA, USA, October 7-15, 2023. pages 286-292, IEEE, 2023. [doi]

Abstract

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