Jose L. Ramirez, Ricardo T. Yoshioka, Carolina C. P. Nunes, Igor Fernandes Namba, Claudemir Coral. Model and simulation of Warpage in packaged IC strips after Mold Array Process. In 33rd Symposium on Integrated Circuits and Systems Design, SBCCI 2020, Campinas, Brazil, August 24-28, 2020. pages 1-5, IEEE, 2020. [doi]
Abstract is missing.