Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc. 3D Integration technology: Status and application development. In 36th European Solid-State Circuits Conference, ESSCIRC 2010, Sevilla, Spain, September 13-17, 2010. pages 9-16, IEEE, 2010. [doi]
@inproceedings{RammKWLTRFC10,
title = {3D Integration technology: Status and application development},
author = {Peter Ramm and Armin Klumpp and Josef Weber and Nicolas Lietaer and Maaike Taklo and Walter De Raedt and Thomas Fritzsch and Pascal Couderc},
year = {2010},
doi = {10.1109/ESSCIRC.2010.5619857},
url = {https://doi.org/10.1109/ESSCIRC.2010.5619857},
researchr = {https://researchr.org/publication/RammKWLTRFC10},
cites = {0},
citedby = {0},
pages = {9-16},
booktitle = {36th European Solid-State Circuits Conference, ESSCIRC 2010, Sevilla, Spain, September 13-17, 2010},
publisher = {IEEE},
isbn = {978-1-4244-6662-7},
}