Rashid Rashidzadeh, Esrafil Jedari, Tareq Muhammad Supon, Vladimir Mashkovtsev. A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs. In 2015 IEEE International Test Conference, ITC 2015, Anaheim, CA, USA, October 6-8, 2015. pages 1-9, IEEE, 2015. [doi]
@inproceedings{RashidzadehJSM15,
title = {A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs},
author = {Rashid Rashidzadeh and Esrafil Jedari and Tareq Muhammad Supon and Vladimir Mashkovtsev},
year = {2015},
doi = {10.1109/TEST.2015.7342390},
url = {http://dx.doi.org/10.1109/TEST.2015.7342390},
researchr = {https://researchr.org/publication/RashidzadehJSM15},
cites = {0},
citedby = {0},
pages = {1-9},
booktitle = {2015 IEEE International Test Conference, ITC 2015, Anaheim, CA, USA, October 6-8, 2015},
publisher = {IEEE},
isbn = {978-1-4673-6578-9},
}