Rashid Rashidzadeh, Esrafil Jedari, Tareq Muhammad Supon, Vladimir Mashkovtsev. A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs. In 2015 IEEE International Test Conference, ITC 2015, Anaheim, CA, USA, October 6-8, 2015. pages 1-9, IEEE, 2015. [doi]
Abstract is missing.